Manual Solder Paste Jet Printing

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Moore observed the trend in the electronics industry that the number of transistors per integrated circuit doubles approximately every two years and made the prediction that this would continue also in the future. His prediction has proved to be more or less valid for almost five decades now, mainly driven by the tough competition between manufacturers that continuously push the development of electronic components to be smaller and faster. This rapid development could hardly have been sustained without efficient, flexible and highly accurate manufacturing methods, which, in turn, requires a thorough understanding of the process of mounting components onto the PCB printed circuit board.

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Jetting simulation of solder paste. In the left part of the figure, the droplet and the adaptive octree mesh are shown together with parts of the computational domain. Before the components can be mounted, solder is applied onto the PCB. The components are then placed on their specific positions on the board with a placement robot and the PCB is heated such that the solder paste melts, adheres to the metalized pad and component and then finally cools to a solid joint. In this way they can produce a given pattern at higher speed than what would be possible with conventional methods.

The driving force in the jet printer is a piezo element that expands rapidly when subjected to an electrical signal and causes a piston to accelerate. The movement of the piston results in a sudden increase of the pressure in the chamber, containing the solder paste, forcing the fluid to squeeze through the printing head nozzle. When the signal is cut off the piezo element retracts and the pressure decreases again.

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  • At this point, the momentum of the fluid is large enough to form a droplet that will travel through the air and impact on the PCB. A total of 45 cm 3 of solder paste was consumed during the test. The flow chart of the service stations is presented in Figure 7. Source: CyberOptics Corporation.


    After the input of the CAD data and compilation of the jetting path using the compilation software, a plan is obtained. The individual deposits that populate each pad are visible in Figure The choice of deposit volumes to populate a given pad is provided by the job compiler to minimize jetting time for the entire PCB. It should be noted that each jetting segment is a straight line and reached via a travelling segment that is controlled by the mechanical machine specifications concerning speed and acceleration.

    The overall jetting results for the tested PCB were good, and generally, there were not any discontinuities concerning deposit volume or positioning that introduced production disturbances. An example of the overall results can be seen in Figure There are distinct peaks in the size distribution that are tied to the provided pad sizes on the PCB. In Figure 11b, the distribution of jetting frequencies for the given PCB is shown.

    The most common jetting frequency is Hz. The jetting results of the V49 ejector with the Senju LFAC19 paste were good relative to the provided volumetric and positioning guidelines. After a performance review, the customer had no major comments to improve. The smallest pitch for the chosen PCB was 0.

    An example of jetting for the 0. The most common volumetric deposit is for the pads of the components. They show stable volume distribution results even if the expected volume defined by compiler were slightly higher than the actual volumes measured with the available SPI.

    Simulation of jet printing of solder paste – Fraunhofer-Chalmers Centre

    The repeatability was approved according to customer requirements Figure For the larger pads of the components, the number of individual deposits can vary due to the compiler optimization discussed earlier, and the variation of volumetric pad coverage is slightly larger. This might be the result of a mixed jetting strategy for that particular component.

    Jetting results for the pads for different jetting strategies can be seen in Figure The resulting volumetric delivery for the component pads for four different PCB panels can be seen in Figure All of these component pads show low volumetric deviation in delivered solder paste volume. The standard deviation of the delivered solder paste volume deviation for SO component pads was 5. The results of the solder joints after reflow in the vapor phase oven are good and were approved according to the specification of the customer.

    An X-ray inspection of the D-pack components showed issues with voids Figure The issue of voiding for this specific component was pre-existing and not judged to be dependent on the manner of paste deposition. Voiding was not an issue for the other utilized component types.

    Simulation of jet printing of solder paste

    The values on weighted tubes and filter boxes before jetting and after jetting is represented in Table 1. Component storage Automated and intelligent material handling. Multi-purpose mask writer Flexibility, productivity and stability. Assembly process management Intelligent software for a complex SMT environment. Mycronic 4. LCD displays Take your photomask quality to the highest levels. High-speed solder paste dispensing Higher volume meets higher yield. Smartphone display Make every pixel count. The perfect solder joint With total volume control. Large area measurement Meet the world's most accurate metrology system.

    Solder Paste Jetting: An Integral Approach

    Material handling Material handling made easy. Service for SMT equipment To boost your productivity. Service for Mask writers Maximize your productivity — invest in uptime and yield. Financing services Competitive fixed interest rates. The future of SMT production is increasingly complex. Denser boards, a wider range of miniaturized components, more NPIs and erratic production schedules.

    Dual lanes. Dual heads.

    As these high-mix challenges go mainstream, real productivity and throughput suffer. The MY high-speed jet dispensing platform for solder paste and a wide range of assembly fluids, incorporates three highly productive machine models, each one with its own set of unique capabilities. A highly advanced motion system makes it possible to dispense fluids on-the-fly at dots per second and 3g acceleration with superior accuracy.

    Dot volume, size and shape are easy to adjust and optimize for each individual component and pad on the board. The MY is a software driven platform and requires no or little operator intervention resulting in a consistent and accurate result for each and every component on the board every time.

    FRITSCH SMT - Dispensing of solder paste - Dispensing machine dispenseALL420 - Jet dispensing

    The dual-lane option allows for efficient handling of boards in the line eliminating board transfer times to virtually zero.